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Shenzhen ChuangYiFeng Industrial Co., Ltd.

Bluetooth Keyboard, Bluetooth Mouse, Bluetooth Touch Pads manufacturer / supplier in China, offering Bluetooth Module Class B Low Engergy Maximum Transmit V4.1 7.5dBm, Customized Waterproof Silicone Rubber Parts Grommets Parts and so on.

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Bluetooth Module Class B Low Engergy Maximum Transmit V4.1 7.5dBm

FOB Price: US $4.9 / Piece
Min. Order: 2,000 Pieces
Min. Order FOB Price
2,000 Pieces US $4.9/ Piece
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Port: Shekou, China
Production Capacity: 2000PCS/Hour
Payment Terms: L/C, T/T, Western Union, Paypal

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Basic Info
  • Model NO.: BTM2CS1010A
  • Bus: Uart
  • Trademark: CYF
  • Specification: 20.5X14.5mm
  • HS Code: 8501109190
  • Type: Bluetooth Transmitter
  • Distance version: Class B
  • Transport Package: Export
  • Origin: China
Product Description
BTM2CS1010A

1. Features
128KB memory: 64KB RAM and 64KB ROM
Bluetooth® v4.1 specification
7.5dBm Bluetooth low energy maximum transmit
output power -92.5dBm Bluetooth low energy receive sensitivity
Support for Bluetooth v4.1 specification host stack including ATT, GATT, SMP, L2CAP, GAP
RSSI monitoring for proximity applications
<900nA current consumption in dormant mode
Programmable general purpose PIO controller
10-bit ADC
12 digital PIOs
3 analogue AIOs
UART
I²C / SPI for EEPROM / flash memory ICs and peripherals
Debug SPI
4 PWM modules
Wake-up interrupt and watchdog timer
Wide Supply-Voltage Range (2 V-3.6 V)
Nominal Supply Voltage at 3.3±0.1V
Surface-mount, Size:20.5×14.5 (unit:mm error = ±0.2mm)
 
2. Product Description
The BTM2CS1010A Module is a CSR μEnergy platform device. CSR μEnergy are CSR's single-mode Bluetooth low energy products for the Bluetooth Smart market. BTM2CS1010A Module increases application code and data space for greater application development flexibility.
CSR μEnergy enables ultra low-power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. BTM2CS1010A Module provides everything required to create a Bluetooth low energy product with RF, baseband, MCU, qualified Bluetooth v4.1 specification stack and customer application running on a single IC.
3. Applications
iPhone, iPad, iPod and Mac products and leading Android devices. Bluetooth low energy takes less time to make a connection than conventional Bluetooth wireless technology and can consume approximately 1/20th of the power of Bluetooth Basic Rate. BTM2CS1010A QFN supports profiles for health and fitness sensors, watches, keyboards, mice and remote controls. Typical Bluetooth Smart applications:
HID: keyboards, mice, touch pads, remote controls
Sports and fitness sensors: heart rate, runner speed and cadence, cycle speed and cadence
Health sensors: blood pressure, thermometer and glucose meters
Mobile accessories: watches, proximity tags, alert tags and camera controls
Smart home: heating control and lighting control
4. Block Diagram

5. Pin Descriptions
5.1 Device Terminal
No. Des   Des No.
1AIO2   AIO024
2SPI-CLK/PIO5 AIO1 23
3SPI-CSB/PIO6 RXD/PIO1 22
4SPI-MOSI/PIO7 TXD/PIO0 21
5SPI-MISO/PIO8 NC 20
6SF-DIN/PIO3 NC 19
7I2C-POWER/PIO2 SPI-EN 18
8SF-CS/PIO4 WAKE 17
9SF-DOUT/I2C-SDA NC 16
10SF-CLK/I2C-SCL PIO11 15
11VCC PIO10 14
12GND PIO9 13
5.2 Device Terminal Functions
PIN NAME DESCRIPTION
1AIO2 Analogue programmable I/O line.
2SPI-CLK/PIO5 Programmable I/O line or debug SPI CLK selected by SPI-EN.
3SPI-CSB/PIO6 Programmable I/O line or debug SPI (CSB) selected by SPI-EN.
4SPI-MOSI/PIO7 Programmable I/O line or debug SPI MOSI selected by SPI-EN..
5SPI-MISO/PIO8 Programmable I/O line or debug SPI MISO selected by SPI-EN.
6SF-DIN/PIO3 Programmable I/O line or SPI serial flash data (SF_DIN) input
7I2C-POWER/PIO2 Programmable I/O line or I2C power.
8SF-CS/PIO4 Programmable I/O line or SPI serial flash chip select (SF_CS#)
9SF-DOUT/I2C-SDA SPI serial flash data (SF_DOUT) output or I2C data line
10SF-CLK/I2C-SCL SPI serial flash data (SF_CLK) clock or I2C clock line
11VCC dc2-3.6V Power Supply
12GND Connect to GND
13PIO9 Programmable I/O line
14PIO10 Programmable I/O line
15PIO11 Programmable I/O line
16NC Do Not Connect This Pin
17WAKE Input to wake module from hibernate or dormant
18SPI-EN Select SPI debug or PIO[8:5] ; active-low to PIO[8:5]
19NC Do Not Connect This Pin
20NC Do Not Connect This Pin
21TXD/PIO0 Programmable I/O line or UART data output 
22RXD/PIO1 Programmable I/O line or UART data input
23AIO1 Analogue programmable I/O line.
24AIO0 Analogue programmable I/O line.

6. Electrical Specifications
6.1 ABSOLUTE MAXIMUM RATINGS(1)
rating MIN MAX UNIT
Battery (VDD_BAT) operation 1.84.4V
I/O supply voltage -0.4 4.4V
Storage temperature range -40 85°C
Other terminal voltages Vss-0.4 Vdd+0.4 V
 
6.2 RECOMMENDED OPERATING CONDITIONS
 MIN MAX UNIT
Operating temperature range -30 85°C
Battery (VDD_BAT) operation 1.83.6V
I/O supply voltage 1.23.6V
 
BTM2CS1010A is reliable and qualified to 4.3V (idle, active and deep sleep modes) and 3.8V (all modes), but there are minor deviations in performance relative to published performance values for 1.8V to 3.6V. For layout guidelines for 4.3V operation, see CSR1000 Hardware Design Review Template.
(b) Safe to 4.3V if VDD_BAT = 4.3V.
 
6.3 Input/Output Terminal Characteristics
Digital Terminals
Output voltage level MIN TYP MAX UNIT
VIL input logic level low -0.4 0.3xVDD_PADS V
VIH input logic level high 0.7x VDD_PADS  VDD- PADS+0.4 V
Tr/Tf   25ms
VOL output logic level low, lOL = 4.0mA   0.4V
VOH output logic level high, lOH = -4.0mA 0.75xVDD_PADS   V
Tr/Tf   5ms
Input and tristate currents MIN TYP MAX UNIT
With strong pull-up -150-40-10uA
I2C with strong pull-up -250  uA
With strong pull-down 1040150uA
With weak pull-up -5-1-0.33uA
With weak pull-down 0.3315uA
CI input capacitance 1 5pF
 
AIO
Input /Output voltage level MIN TYP MAX UNIT
Input voltage 0 VDD-AUX V
Output voltage 0 VDD-AUX V
 
6.4 ESD Protection
Apply ESD static handling precautions during manufacturing. Table shows the ESD handling maximum ratings.
condition class Max rating
Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 22000V (all pins)
Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 III 500V (all pins)
 
7. Circuit Description
System RAM
64KB of integrated RAM supports the RISC MCU and is shared between the ring buffers used to hold data for each active connection, general-purpose memory required by the Bluetooth stack and the user application .
Internal ROM
BTM2CS1010A QFN has 64KB of internal ROM. This memory is provided for system firmware implementation. If the internal ROM holds valid program code, on boot-up, this is copied into the program RAM.
Microcontroller
The MCU, interrupt controller and event timer run the Bluetooth software stack and control the Bluetooth radio and external interfaces. A 16-bit RISC microcontroller is used for low power consumption and efficient use of memory.
Programmable I/O Ports, PIO and AIO
12 lines of programmable bidirectional I/O are provided. They are all powered from VDD_PADS. PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. Note:
At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt request lines or to wake the IC from deep sleep mode.
Programming and Debug Interface
Important Note:
The BTM2CS1010A module debug SPI interface is available in SPI slave mode to enable an external MCU to program and control the BTM2CS1010A QFN, generally via libraries or tools supplied by CSR. The protocol of this interface is proprietary. The 4 SPI debug lines directly support this function.
The SPI programs, configures and debugs the BTM2CS1010A QFN. It is required in production.
 

Ensure the 4 SPI signals are brought out to either test points or a header.

Take SPI_PIO#_SEL high to enable the SPI debug feature on PIO[8:5].

Reset

BTM2CS1010A QFN is reset by:

Power-on reset

Software-configured watchdog timer

 

8. Solder Profiles

Composition of the solder ball: Sn 95.5%, Ag 4.0%, Cu 0.5%

 

Typical Lead-Free Re-flow Solder Profile

Key features of the profile:

l Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium

l Equilibrium time = 60 to 180 seconds

l Ramp to Maximum temperature (250°C) = 3°C/sec max.

l Time above liquidus temperature (217°C): 45-90 seconds

l Device absolute maximum reflow temperature: 260°C

 

Devices will withstand the specified profile. Lead-free devices will withstand up to three reflows to a maximum temperature of 260°C.

Notes:They need to be baked prior to mounting.

 

 

9. Physical Dimensions
Recommend PCB Layout
a b c d e g h Unit
57034.9325027807.1196.8mil
14.50.8860.8131.270.720.55mm
        
 

 
Shenzhen ChuangYiFeng Industrial Co., Ltd.
Building B3, Chuangfu Industrial Park, Tongfuyu Industrial Zone, Baoan District, Shenzhen, Guangdong, China 518108
LiuJiang/Overseas Sales Department.
Cell:+86 13713593065
 
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